Mobileye CES 2016 presentation has a slide on its requests to ON Semi and Sony on the future automotive image sensors, starting from time 27:30:
Thanks to DS for the link!
Update: The CES 2016 presentation video has been posted on Youtube:
2016 IS&T International Symposium on Electronic Imaging to be held on Feb. 14–18 in San Francisco, CA, publishes its preliminary Program. There are many image sensor related short courses and papers:
EI13: Introduction to CMOS Image Sensor Technology
Ins
Mashable got a chance to see Light Co's L16 52MP array camera prototype at CES 2016. Few quotes from Mashable impressions:
"On the prototype, the photo stitching took a little while to work and froze. In the end, I didn't get to see how fast it was. When I a
VentureBeat reports that Lenovo and Google announce a partnership to create a smartphone with 3D camera-based Project Tango. Jeff Meredith, Lenovo VP, said the goal was to make a mainstream device scheduled to appear on the market on summer 2016.
NVIDIA launches NVIDIA DRIVE PX 2, said to be the world’s most powerful engine for in-vehicle artificial intelligence. DRIVE PX 2 can process the inputs of 12 video cameras, plus lidar, radar and ultrasonic sensors. It fuses them to accurately detect objects
PRNewswire: Socionext (Fujitsu + Panasonic Semi) introduces “M-12MO” (MBG967) Milbeaut Image Processor. The MBG967, which will be available in volume shipments starting in January, is mainly targeted at smartphones and other mobile applications. It supports
BusinessWire: Ambarella introduces the H2 and H12 camera SoCs for sports and flying cameras. 14nm process-based H2 targets high-end camera models with 4K Ultra HD H.265/HEVC video at 60 fps and 4K AVC video at 120 fps and includes 10-bit HDR video processing
Intel announces R200 RealSense 3D camera, said to be the company's first long-range depth camera for 2 in 1s and tablets. The new camera is aimed to:
3D scanning: Scan people and objects in 3D to share on social media or print on a 3D printer.
Immersive Gam
Himax announces that its Wafer Level Optics (“WLO”) laser diode collimator with integrated Diffractive Optical Element (“DOE”) has been integrated into laser projectors for next-generation structured light camera. Himax's WLO systemhas a height of less than
BusinessWire: Heptagon introduces OLIVIA, a complete ToF system module with an integrated microprocessor, adaptive algorithms, advanced optics, ToF sensor and light source. OLIVIA can accurately measure distance up to 2 meters in normal lighting conditions, c
